Helios Auto TEM
Dedicated and efficient Failure Analysis Professional offering over 20 years of Semiconductor experience specializing in FIB/SEM failure analysis systems supporting manufacturing and technology development organizations. Extensive managerial experience supporting diverse team members focused on personal and professional growth mindsets. Semiconductor memory clean room processing and operational testing knowledge, including completion of Micron Technology internal confidential semiconductor based physics/electrical/materials courses with a recent focus on 3D NAND technologies.
Cleanroom process monitoring of Micron NAND development processes, identifying sources of defects and providing root cause information and solutions to multiple internal teams through data analysis, material construction knowledge, and intended electrical operations.
Reporting product/process needs to external vendors through effective communications, identifying realistic expectations along with future looking goal sets. Highly successful external vendor collaborations to attain first of a kind inline failure detection and cost savings performance.
Die level NAND part type electrical testing, including probe bin verification, electrical defect categorization, NAND cell test mode operations identifying unique fab process related failure mechanisms. Photo emission platform operation for die level high current and resistance change defect targeting. Failure mechanism reporting for Fab Process Integration yield solutions.
Technology Development Yield Enhancement Area Manager responsible for lab workflow and sample management over multiple lab tracking software packages. Priority alignment of departmental and Fabrication unit goal sets in relation to SEM/PFA lab personnel and platform resources/capabilities.
Assessment of employee performance via sample metrics, technical aptitude, and performance/development personal goal setting methodologies. Accountable for driving achievable, yet challenging milestones for teams of up to twenty-one employees through biweekly check-ins, quarterly updates and yearly performance reviews.
Constant internal customer support to Fab Teams (Dry Etch, CVD, Photo, Process Integration, etc.). SEM cross section and defect analysis reporting for process enhancements across all NAND, DRAM and Emerging Memory technologies.
Point of contact for SEM and Failure Analysis equipment vendors, generating feedback to ensure current and future platform development successes.
Small Team/Shift Leader, responsible for tracking groups task/analysis progress at the sample level. Provide tactical technical support, daily probe bin yield review. Initial experience w/personnel management.
Nuclear certified Electrician responsible for reactor support maintenance and ships electrical load distribution. USS Carl Vinson (CVN70)
Laboratory equipment operations
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